Installing of dvd drive
1.) Intro and Powering Down
This guide was developed to instruct users on the proper method to install an ATA based optical drive into a desktop computer system. These instructions are valid for any form of optical based drive such as CD-ROM, CD-RW, DVD-Rom or DVD burners. It is a step-by-step instruction guide with photographs detailing the individual steps.
The very first thing to do whenever working on a computer system is to make sure there is no power. Shut down the computer if it is running. Once the computer has safely shut down, turn the internal power off by slipping the switch on the back of the power supply and removing the AC power cord.
2.) Opening up the Computer
At this point, the computer needs to be opened up to properly install the CD or DVD drive into the computer. The method for opening the case will vary depending upone the case. Most new systems will use a panel or door on the side of the system while older systems may require the whole cover be removed. Remove and set aside and screws fastening the cover or panel to the computer case and then remove the cover.
3.) Remove the Drive Slot Cover
Computer cases can generally hold a number of external drives but only a few are generally used. Any unsed drive slot has a cover that prevents dust from entering the computer and makes the case look better. To install the drive, it will be necessary to remove a 5.25" drive slot cover from the case. Removal of these generally is done by pushing some tabs either on the inside or outside of the case. Some may be screwed into the case.
4.) Setting the IDE Drive Mode
The majority of all CD and DVD drives for computer systems use the IDE interface. This interface can have two devices on a single cable. Each device on the cable must be placed into the appropriate mode for the cable. One drive is listed as the master and the other secondary drive is listed as a slave. This setting is generally handled by one or more jumpers on the back of the drive. Consult the documentation or diagrams on the drive for the location and settings for the drive.
If the CD/DVD drive is going to be installed on an existing cable, the drive needs to be set into the Slave mode. If the drive is going to reside on its own IDE cable alone, the drive should be set to the Master mode.
5.) Setting the IDE Drive Mode
The majority of all CD and DVD drives for computer systems use the IDE interface. This interface can have two devices on a single cable. Each device on the cable must be placed into the appropriate mode for the cable. One drive is listed as the master and the other secondary drive is listed as a slave. This setting is generally handled by one or more jumpers on the back of the drive. Consult the documentation or diagrams on the drive for the location and settings for the drive.
If the CD/DVD drive is going to be installed on an existing cable, the drive needs to be set into the Slave mode. If the drive is going to reside on its own IDE cable alone, the drive should be set to the Master mode.
6.) Attaching the Internal Audio Cable
Many people use the CD/DVD drive inside of their computer to listen to audio CDs. In order for this to work, the audio signal from the CD needs to be routed from the drive to the computer audio solution. This is typically handled by a small two wire cable with a standard connector. Plug this cable into the back of the CD/DVD drive. The other end of the cable will plug either into a PC audio card or motherboard depending upon which the computer uses for audio. Plug the cable into the connector labeled as CD Audio.
7.) Attaching the Internal Audio Cable
Many people use the CD/DVD drive inside of their computer to listen to audio CDs. In order for this to work, the audio signal from the CD needs to be routed from the drive to the computer audio solution. This is typically handled by a small two wire cable with a standard connector. Plug this cable into the back of the CD/DVD drive. The other end of the cable will plug either into a PC audio card or motherboard depending upon which the computer uses for audio. Plug the cable into the connector labeled as CD Audio.
8.) Attaching the Internal Audio Cable
Many people use the CD/DVD drive inside of their computer to listen to audio CDs. In order for this to work, the audio signal from the CD needs to be routed from the drive to the computer audio solution. This is typically handled by a small two wire cable with a standard connector. Plug this cable into the back of the CD/DVD drive. The other end of the cable will plug either into a PC audio card or motherboard depending upon which the computer uses for audio. Plug the cable into the connector labeled as CD Audio.
9.) Attaching the Internal Audio Cable
Many people use the CD/DVD drive inside of their computer to listen to audio CDs. In order for this to work, the audio signal from the CD needs to be routed from the drive to the computer audio solution. This is typically handled by a small two wire cable with a standard connector. Plug this cable into the back of the CD/DVD drive. The other end of the cable will plug either into a PC audio card or motherboard depending upon which the computer uses for audio. Plug the cable into the connector labeled as CD Audio.
10.) Powering up the Computer
All of the installation steps for the CD or DVD drive are now completed. The only thing left to do is return power to the computer. Plug the AC cord back into the power supply and be sure to flip the switch to the on position.
The computer system should automatically detect and begin using the new drive. Since CD and DVD drives are very standardized, it should not be necessary to install any specific drivers. Be sure to consult the instruction manual that came with the drive for any specific instructions for your operating system.
Thursday, January 31, 2008
Wednesday, January 30, 2008
Assignment #4
Package types of CPU
S.E.P. Package Type
S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to a S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 24 pins.
S.E.C.C.2 Package Type
The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).
S.E.C.C. Package Type
S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.
PPGA Pac
kage Type
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.
PGA Package Type
PGA is
short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.
OOI Package Type
OOI is sho
rt for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.
FC-PGA Package Type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.
FC-PGA2 Package Type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).
FC-LGA4 Package type
TypeThe FC-LGA4 package is used with Pentium® 4 processors designed for the LGA775 socket. FC-LGA4 is short for Flip Chip Land Grid Array 4. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number 4 stands for the revision number of the package.This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink.You may also see references to processors in the 775-LAND package. This refers to the number of contacts that the new package contains that interface with the LGA775 socket.The pictures below include the LAND Slide Cover (LSC). This black cover protects the processor contacts from damage and contamination and should be retained and placed on the processor whenever it is removed from the LGA775 socket
S.E.P. Package Type
S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to a S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 24 pins.S.E.C.C.2 Package Type
The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).S.E.C.C. Package Type
S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.
PPGA Pac
kage TypePPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.
PGA Package Type
PGA is
short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.OOI Package Type
OOI is sho
rt for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.FC-PGA Package Type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.
FC-PGA2 Package Type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).
FC-LGA4 Package type
TypeThe FC-LGA4 package is used with Pentium® 4 processors designed for the LGA775 socket. FC-LGA4 is short for Flip Chip Land Grid Array 4. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number 4 stands for the revision number of the package.This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink.You may also see references to processors in the 775-LAND package. This refers to the number of contacts that the new package contains that interface with the LGA775 socket.The pictures below include the LAND Slide Cover (LSC). This black cover protects the processor contacts from damage and contamination and should be retained and placed on the processor whenever it is removed from the LGA775 socket
Sunday, January 20, 2008
Motherboard form factor
Motherboard form factor
NLX
NLX (New Low Profile Extended) was a form factor proposed by Intel and developed jointly with IBM, DEC, and other vendors for low profile, low cost, mass-marketed retail PCs. Release 1.2 was finalized in March 1997 and release 1.8 was finalized in April 1999. NLX was similar in overall design to LPX, including a riser card and a low-profile slimline case. It was modernized and updated to allow support for the latest technologies while keeping costs down and fixing the main problems with LPX.
Many slimline systems that were formerly designed to fit the LPX form factor were modified to fit NLX. NLX is a true standard, unlike LPX, making interchangeability of components easier than it was for the older form factor. IBM, Gateway, and NEC produced a fair number of NLX computers in the late 1990s, primarily for Socket 370 (Pentium II-III and Celeron), but NLX never enjoyed the widespread acceptance that LPX had. Most importantly, one of the largest PC manufacturers, Dell decided against using NLX and created their own proprietary motherboards for use in their slimline systems. Although many of these computers and motherboards are still available secondhand, new production has essentially ceased, and in the slimline and small form factor market, NLX has been superseded by the Micro-ATX, FlexATX, and Mini-ITX form factors.
NLX
NLX (New Low Profile Extended) was a form factor proposed by Intel and developed jointly with IBM, DEC, and other vendors for low profile, low cost, mass-marketed retail PCs. Release 1.2 was finalized in March 1997 and release 1.8 was finalized in April 1999. NLX was similar in overall design to LPX, including a riser card and a low-profile slimline case. It was modernized and updated to allow support for the latest technologies while keeping costs down and fixing the main problems with LPX.
Many slimline systems that were formerly designed to fit the LPX form factor were modified to fit NLX. NLX is a true standard, unlike LPX, making interchangeability of components easier than it was for the older form factor. IBM, Gateway, and NEC produced a fair number of NLX computers in the late 1990s, primarily for Socket 370 (Pentium II-III and Celeron), but NLX never enjoyed the widespread acceptance that LPX had. Most importantly, one of the largest PC manufacturers, Dell decided against using NLX and created their own proprietary motherboards for use in their slimline systems. Although many of these computers and motherboards are still available secondhand, new production has essentially ceased, and in the slimline and small form factor market, NLX has been superseded by the Micro-ATX, FlexATX, and Mini-ITX form factors.
LPX
LPX is a motherboard form factor used in the 1990s. LPX is a non-standard proprietary form factor found in mostly low-profile cases. LPX design normally featured the main I/O ports mounted on the back of the motherboard and a riser card in the center of the motherboard, on which the PCI and ISA slots were mounted. Most LPX motherboards have sound and video integrated onto the motherboard.
LPX form factor is suit for low-cost and space saving product they are generally difficult to repair due to a lack of space and overall non-standardization.
LPX form factor is suit for low-cost and space saving product they are generally difficult to repair due to a lack of space and overall non-standardization.
AT
In 1985 IBM introduced Baby AT. Soon after all computer makers abandoned AT for the cheaper and smaller Baby AT, using it for computers from the 286 processors to the first Pentiums. These motherboards have similar mounting hole positions and the same eight card slot locations as those with the AT form factor, but are 2" (51 mm) narrower and marginally shorter. The size (220x330 mm) and flexibility of this kind of motherboard were the key to success of this format. While now obsolete, a few computers are still using it, and modern PC cases are generally backwards compatible to fit Baby AT.
In 1995, Intel introduced ATX, a modern form factor which gradually replaced older Baby AT motherboards. During the late 1990s, a great majority of boards were either Baby AT or ATX. Many motherboard manufacturers continued making Baby AT over ATX since many computer cases and power supplies in the industry were still compatible with AT boards and not ATX boards. Also, the lack of an eighth slot on ATX motherboards kept it from being used in some servers. After the industry adapted to ATX specifications, it became common to design cases and power supplies to support both Baby AT and ATX motherboards.
In 1995, Intel introduced ATX, a modern form factor which gradually replaced older Baby AT motherboards. During the late 1990s, a great majority of boards were either Baby AT or ATX. Many motherboard manufacturers continued making Baby AT over ATX since many computer cases and power supplies in the industry were still compatible with AT boards and not ATX boards. Also, the lack of an eighth slot on ATX motherboards kept it from being used in some servers. After the industry adapted to ATX specifications, it became common to design cases and power supplies to support both Baby AT and ATX motherboards.
ATX
The ATX (for Advanced Technology Extended) form factor was created by Intel in 1995. It was the first big change in computer case and motherboard design in many years. ATX overtook AT completely as the default form factor for new systems. ATX addressed many of the AT form factor's annoyances that had frustrated system builders. Other standards for smaller boards (including microATX, FlexATX and mini-ITX) usually keep the basic rear layout but reduce the size of the board and the number of expansion slot positions. In 2003, Intel announced the new BTX standard, intended as a replacement for ATX. As of January 2007 the ATX form factor remains the industry standard for do-it-yourselfers; BTX has however made inroads into pre-made systems, being adopted by computer makers like Dell, Gateway, and HP.
The official specifications were released by Intel in 1995, and have been revised numerous times since, the most recent being version 2.2[1], released in 2004.
A full size ATX board is 12" wide by 9.6" deep (305 mm x 244 mm). This allows many ATX form factor chassis to accept microATX boards as well.
The official specifications were released by Intel in 1995, and have been revised numerous times since, the most recent being version 2.2[1], released in 2004.
A full size ATX board is 12" wide by 9.6" deep (305 mm x 244 mm). This allows many ATX form factor chassis to accept microATX boards as well.
Wednesday, January 16, 2008
2nd trinal Assignment
LPX / Mini LPX Form Factor
Without knowing it, retail PC customers have made LPX one of the most popular form factors of the last decade. Most PCs sold in slimline or "low profile" cases in the late 1980s and early 1990s use the LPX form factor, or a variant of it. Originally developed by hard disk manufacturer Western Digital Corporation back when they made motherboards, the goal of the LPX design was simple: to reduce the size and cost of the PC system box. The key design decision in LPX that enables the dramatic reduction of the size of the case is the creation of a riser card that plugs into the motherboard. Expansion cards then plug into the riser card, parallel to the motherboard. By doing this, the case no longer has to be tall enough to accommodate the height of an expansion card. See the discussion of the LPX motherboard form factor for more details on the LPX design.
One problem with the LPX form factor is that it is only a "pseudo-standard"; it was never formalized into a hard standard, the way for example ATX and NLX have been. Many companies make systems that use slimline cases and LPX-style motherboards and power supplies, but they often differ slightly in size, shape, or other characteristics. This means you cannot expect to move a power supply from say, a Compaq LPX system into a similar-looking Packard Bell system. LPX systems are essentially proprietary.
There is one innovation of the LPX form factor that has carried forward into the more modern designs: the use of integrated I/O connectors, and holes provided for them in the system case. The lack of this design in the Baby AT form factor led to increased cost and time of assembly, a problem avoided with the newer form factors.
LPX cases are usually used with LPX form factor power supplies, which are sometimes called "slimline" supplies because LPX systems are often referred to by their "slimline" style.
NLX Form Factor
NLX is Intel's proposal for the future of mass-marketed, retail PCs, replacing LPX. It is similar in overall design to LPX, with a riser card arrangement and low profile, slimline case. However, it has been updated and modernized to allow support for the latest technologies while keeping costs down. For a full description of the NLX form factor's characteristics and design goals, see the motherboard form factors section on NLX. You can also find detailed specifications about NLX and other newer form factors at the Platform Development Support Web Site.
Many slimline systems that were formerly designed to fit the LPX form factor are now moving over to NLX. One extra advantage of NLX over LPX is that it is a true standard, unlike LPX, making interchangeability of components more likely than it was for the older form factor. NLX seems destined to become of the most popular form factors in the PC world, complementing the ATX "family" of form factors.
The NLX specification does not define a new, specific "NLX" power supply form factor. NLX systems are intended to use ATX form factor power supplies.
Without knowing it, retail PC customers have made LPX one of the most popular form factors of the last decade. Most PCs sold in slimline or "low profile" cases in the late 1980s and early 1990s use the LPX form factor, or a variant of it. Originally developed by hard disk manufacturer Western Digital Corporation back when they made motherboards, the goal of the LPX design was simple: to reduce the size and cost of the PC system box. The key design decision in LPX that enables the dramatic reduction of the size of the case is the creation of a riser card that plugs into the motherboard. Expansion cards then plug into the riser card, parallel to the motherboard. By doing this, the case no longer has to be tall enough to accommodate the height of an expansion card. See the discussion of the LPX motherboard form factor for more details on the LPX design.
One problem with the LPX form factor is that it is only a "pseudo-standard"; it was never formalized into a hard standard, the way for example ATX and NLX have been. Many companies make systems that use slimline cases and LPX-style motherboards and power supplies, but they often differ slightly in size, shape, or other characteristics. This means you cannot expect to move a power supply from say, a Compaq LPX system into a similar-looking Packard Bell system. LPX systems are essentially proprietary.
There is one innovation of the LPX form factor that has carried forward into the more modern designs: the use of integrated I/O connectors, and holes provided for them in the system case. The lack of this design in the Baby AT form factor led to increased cost and time of assembly, a problem avoided with the newer form factors.
LPX cases are usually used with LPX form factor power supplies, which are sometimes called "slimline" supplies because LPX systems are often referred to by their "slimline" style.
NLX Form Factor
NLX is Intel's proposal for the future of mass-marketed, retail PCs, replacing LPX. It is similar in overall design to LPX, with a riser card arrangement and low profile, slimline case. However, it has been updated and modernized to allow support for the latest technologies while keeping costs down. For a full description of the NLX form factor's characteristics and design goals, see the motherboard form factors section on NLX. You can also find detailed specifications about NLX and other newer form factors at the Platform Development Support Web Site.
Many slimline systems that were formerly designed to fit the LPX form factor are now moving over to NLX. One extra advantage of NLX over LPX is that it is a true standard, unlike LPX, making interchangeability of components more likely than it was for the older form factor. NLX seems destined to become of the most popular form factors in the PC world, complementing the ATX "family" of form factors.
The NLX specification does not define a new, specific "NLX" power supply form factor. NLX systems are intended to use ATX form factor power supplies.
Thursday, November 15, 2007
Assignment #1
Motherboard
Intel D865PERL Motherboard (Pentium 4 w/ HT Technology, Socket 478, Intel 865PE, ATX, 4GB DDR, 800MHz FSB - MPN: BLKD865PERL)
Price Range: $309.00 - $840.00 from 2 Sellers
Rebates & Special Offers:
Description: This is a 10-pack.The Intel Desktop Board BLKD865PERL harnesses the advanced computing power of the latest Intel Pentium 4 processor supporting Hyper-Threading Technology. It features the Intel 865P Chipset on an ATX board and is designed.
Price Range: $309.00 - $840.00 from 2 Sellers
Rebates & Special Offers:
Description: This is a 10-pack.The Intel Desktop Board BLKD865PERL harnesses the advanced computing power of the latest Intel Pentium 4 processor supporting Hyper-Threading Technology. It features the Intel 865P Chipset on an ATX board and is designed.
The breakthrough performance, energy efficiency, and reliability of Intel® Xeon® processor-based server systems make them the ideal choice for all of your data demanding or standard enterprise infrastructure applications.
Intel® processor-based servers enable businesses worldwide to do more and spend less—with outstanding price/performance and broad 64-bit choice across OEMs, operating systems, and applications. Supported by a single stable mainstream 2P server platform supporting a range of CPU options for IT flexibility, investment protection and easy migration from dual core to quad-core technology.
Reliable, efficient, proven performance. Why would you depend on anything else? Intel® Xeon® processor-based servers deliver it all. Put Intel® server technology to work in your datacenter.
Intel® processor-based servers enable businesses worldwide to do more and spend less—with outstanding price/performance and broad 64-bit choice across OEMs, operating systems, and applications. Supported by a single stable mainstream 2P server platform supporting a range of CPU options for IT flexibility, investment protection and easy migration from dual core to quad-core technology.
Reliable, efficient, proven performance. Why would you depend on anything else? Intel® Xeon® processor-based servers deliver it all. Put Intel® server technology to work in your datacenter.
MemoryCore 2 Duo (Conroe) launched about twelve days ago with a lot of fanfare. With the largest boost in real performance the industry has seen in almost a decade it is easy to understand the big splash Core 2 Duo has made in a very short time. AnandTech delivered an in-depth analysis of CPU performance in Intel's Core 2 Extreme & Core 2 Duo: The Empire Strikes Back. With so much new and exciting information about Conroe's performance, it is easy to assume that since Core 2 Duo uses DDR2, just like NetBurst, then memory performance must therefore be very similar to the DDR2-based Intel NetBurst architecture.Actually, nothing could be further from the truth. While the chipsets still include 975X and the new P965 and the CPU is still Socket T, the shorter pipes, 4 MB unified cache, intelligent look-ahead, and more work per clock cycle all contribute to Conroe exhibiting very different DDR2 memory behavior. It would be easy to say that Core 2 Duo is more like the AMD AM2, launched May 23rd, which now supports DDR2 memory as well. That would be a stretch, however, since AM2 uses an efficient on-processor memory controller, and the launch review found Core 2 Duo faster at the same clock speed than the current AM2. This is another way of saying Conroe is capable of doing more work per cycle - something we had been saying for several years about Athlon64 compared to NetBurst,The move by AMD from Socket 939 to Socket AM2 is pretty straightforward. The new AM2 processors will continue to be built using the same 90nm manufacturing process currently used for Athlon 64 processors until some time in early to mid-2007. AMD will then slowly roll-out their 65nm process from the bottom of the line to the top according to AMD road-maps. This could include memory controller enhancements and possibly more. Performance of AM2 only changed very slightly with the move to DDR2, generally in the range of 0% to 5%. The only substantive difference with AM2 is the move from DDR memory to official AMD DDR2 memory support.Our AM2 launch reviews and the article First Look: AM2 DDR2 vs. 939 DDR Performance found that AM2 with DDR2-533 memory performed roughly the same as the older Socket 939 with fast DDR400 memory. Memory faster than DDR2-533, namely DDR2-667 and DDR2-800, brought slightly higher memory performance to AM2.The Core 2 Duo introduction is quite different. Clock speed moved down and performance moved up. The top Core 2 Duo, the X6800, is almost 1GHz slower than the older top NetBurst chip and performs 35% to 45% faster. With the huge efficiency and performance increases comes different behavior with DDR2 memory.With the world now united behind DDR2, it is time to take a closer look at how DDR2 behaves on both the new Intel Core 2 Duo and the AMD AM2 platforms. The performance of both new DDR2 platforms will also be compared to NetBurst DDR2 performance, since the DDR2 NetBurst Architecture has been around for a couple of years and is familiar. We specifically want to know the measured latency of each new platform, how they compare in memory bandwidth, and the scaling of both Core 2 Duo and AM2 as we increase memory speed to DDR2-1067 and beyond. With this information and tests of the same memory on each platform, we hope to be able to answer whether memory test results on Conroe, for instance, will tell us how the memory will perform on AM2.In addition we have an apples-apples comparison of AM2 and Core 2 Duo running at 2.93GHz (11x266) using the same memory at the same timings and voltages with the same GPU, hard drive, and PSU. This allows a direct memory comparison at 2.93GHz at DDR2-1067. It also provides some very revealing performance results for Core 2 Duo and AM2 at the exact same speeds in the same configurations.
Expansion slots
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